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RoHS directive compliant crystal unit EPSON Q22FA23V00019 for in various consumer electronic devices

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RoHS directive compliant crystal unit EPSON Q22FA23V00019 for in various consumer electronic devices

Description : SMD3225-4P Crystals RoHS

Mfr. Part # : Q22FA23V00019

Model Number : Q22FA23V00019

Package : SMD3225-4P

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Product Overview

The FA-238V is a crystal unit designed as a component for general consumer electronics equipment. It complies with the RoHS Directive and is delivered by Seiko Epson Corporation to DELTA ELECTRONICS, INC. This product is not intended for use in applications requiring extremely high reliability, such as weapons of mass destruction, purposes, or critical life-support systems.

Product Attributes

  • Brand: SEIKO EPSON CORPORATION
  • Origin: Japan
  • Certifications: RoHS Directive compliant

Technical Specifications

ItemSymbolRating ValueUnitConditionsNotes
Absolute maximum ratingsT_stg-40 to +125CDepends on the Environmental characteristics specifications.
Operating rangeT_use-20 to +70C
DL1 to 100200 W
Static characteristicsf_o12MHzFundamental
f_tol50 x 10-6CL = 10 pF, Ta = +25 C, DL : 100 W (Not include aging)
R1100Max.Max. circuit IEC 60444-2, Ta = Operating temperature range, DL : 100 W
C05.0Max. pF circuit and N.A.
f_tem30 x 10-6Ta = Operating temperature range (Ref. at Ta = +25 C 3 C), DL : 100 W
IR500Min. MDC 100 V, 15, 60 seconds between each terminals
f_age5 x 10-6/yearTa = +25 C 3 C
Environmental and mechanical characteristicsShock10 to 100 g100 g dummy Jig (Seiko Epson Standard) drop from 1 500 mm height on the Concrete, 3 directions, 10 timesf / f [1 x 10-6] 10
Vibration10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s2, 10 Hz to 500 Hz 15 min./cycle, 6 h (2 hours, 3 directions)f / f [1 x 10-6] 5
High temperature storage+85 C1 000 hf / f [1 x 10-6] 5
Low temperature storage-40 C1 000 hf / f [1 x 10-6] 5
Temperature cycle-40 C to +85 C30 minutes at each temp., 100 cyclef / f [1 x 10-6] 5
Temperature humidity storage+85 C, 85 %RH1 000 hf / f [1 x 10-6] 10
Resistance to soldering heatFor convention reflow soldering furnace (3 times)Shift motional resistance at after above tests should be less than 20 % or less than 10 .
Substrate bendingBend width reaches 3.0 mm and hold for 5 s, 1 s, 1 time, Ref. IEC 60068-2-21No peeling-off at a soldered part
Shear10 N press for 10 s, 1 s, Ref. IEC 60068-2-21No peeling-off at a soldered part
Pull off10 N press for 10 s, 1 s, Ref. IEC 60068-2-21No peeling-off at a soldered part
SolderabilityDip termination into solder bath at +235 C 5 C for 5 s (Using Rosin Flux)Terminals must be 95 % covered with fresh solder.

2410121449_EPSON-Q22FA23V00019_C2924281.pdf


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